Adewo at TOKYO PACK: Exploring Die Making Practices in Japan

● 2026-11-09 ● - ● Leave me a message

ADEWO at TOKYO PACK: Exploring Die Making Practices in Japan

ADEWO participated in TOKYO PACK 2026 in Tokyo, Japan, together with its Japanese partner UNIFLEX. 

During the exhibition, ADEWO presented its latest die making equipment and took the opportunity to connect with local die makers, exchange technical insights and gain a deeper understanding of the Japanese die making industry.

Showcasing New Die Making Equipment at TOKYO PACK

At TOKYO PACK 2026, ADEWO showcased new equipment designed to support modern steel rule die manufacturing, including its automatic rule bending machine and laser welding machine.

Through on-site demonstrations, visitors had the opportunity to learn more about the equipment's functions, processing capabilities and practical applications. 

ADEWO aims to provide advanced and reliable equipment to help die making companies improve production efficiency and overcome manufacturing challenges.

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Connecting and Exchanging Insights with Japanese Die Makers

Beyond the exhibition, ADEWO also visited and communicated with local Japanese die making companies.

These exchanges provided valuable opportunities to learn about their production processes, equipment requirements and expectations for die making technology. 

By listening directly to experienced professionals in the Japanese market, ADEWO gained a better understanding of local industry practices and customer needs.


Gaining Recognition from Local Industry Professionals

During the exhibition and business exchanges, ADEWO's equipment and die making solutions received positive feedback from local industry professionals.

Their interest and recognition encouraged our team and strengthened our confidence in serving the Japanese market. 

We believe that direct communication and practical demonstrations are important ways to build trust and develop long-term partnerships.


Learning, Improving and Moving Forward

For ADEWO, participating in TOKYO PACK was more than an opportunity to showcase products. It was also a valuable learning experience.

By exchanging ideas with Japanese die makers and industry professionals, we gained new perspectives on equipment performance, production efficiency and the future development of die making technology.

ADEWO will continue to listen to customers, improve its products and develop practical solutions for die making companies around the world.

We sincerely thank everyone who visited our booth and shared their experience with us. We look forward to more opportunities to learn, exchange and grow together.


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